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ELECTRONIC DESIGN SERVICE
A complete design service for almost
any type of PCB from single to multilayer structures with
high levels of configuration complexity and all types of
Electronic Assembly and Sub-Assembly.
This service provides the assurance that
designs are application specific and fully proven through
prototyping and functional testing prior to fabrication.
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PRODUCT ASSEMBLY
From all types of PCB’s to complete
electronic, mechanical and electromechanical assemblies or
units and/or sub-assemblies.
This service offers the user
the confidence that product assembly is undertaken under
controlled conditions using the most up-to-date component
placement and automated soldering processes and/or manual
soldering techniques.
With over 25-years experience in electronic,
mechanical and electromechanical assembly, we offer a comprehensive
capability.
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PCB REPAIR, TEST & CALIBRATION
Critical expertise in fault-finding on
PCB’s allows Reltech Limited to undertake a high level
of repair on all types of PCB from single to multilayer structures.
Following the repair, PCB’s are fully tested using
our installed equipment by specialist Test Engineers and
where required subjected to a recalibration process thus
ensuring that the customer receives a fully repaired, tested
and calibrated product.
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EQUIPMENT MAINTENANCE, REPAIR,
REFURBISHMENT
& CALIBRATION
Our team of dedicated Service Engineers
offer a second to none service to ensure that your high performance
test equipment can be operated continuously and maintain
its critical test performance parameters.
Routine maintenance & servicing options provide a high
quality service to keep your equipment fully functional and
is supported by a complete repair & refurbishment service
and where required, equipment recalibration.
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TEST SOCKET CONSULTANCY
The selection of the Test Socket is critical
to the integrity of a component and/or its device test function.
There are currently a number of test socket
manufacturers offering a multitude of different socket styles
to suit modern day package technologies, including QFN, CSP
(Chip Scale Package), BGA (Ball Grid Array), PQFP, etc.
Reltech Limited has
a vast amount of experience in this market, enabling you
to receive the best advice and ensure correct selection of
the socket most suited to your test needs; assuring you of
a high level of performance and operating speeds to withstand
even the most hostile test environment.
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