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FREQUENTLY ASKED QUESTIONS
Burn-In is the application of thermal and electrical stress for the purposes of inducing the failure of "marginal (microelectronic) devices, those with inherent defects or defects resulting from manufacturing aberrations which cause time and stress dependant failures. More Information
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The reliability of a semiconductor device is determined by its ability to perform its required functions under the stipulated conditions for a finite period of time. Quantifiable yardsticks such as the reliability rate, failure rate, and mean time to failure (MTTF) are used to measure reliability.
Customers naturally expect semiconductor devices to perform the required functions from the moment they are first used, and they also expect the devices to function without failure throughout the expected period of use.
The objective of reliability testing is to confirm a semiconductor device's fault-free operation and estimated useful life by exposing the device to accelerated or marginal stress, based on the amount of stress (thermal stress, mechanical stress, electrical stress etc) that the device is estimated to undergo during manufacture, shipping and normal use.
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This methodology applies to the qualification of all semiconductor processes, packages and materials used by the manufacturer including:
. New processes, Packages, Products, Wafer Foundries, Assembly Subcontractors.
. Changes to Processes/Packages/Materials/Locations/Design Rules.
Successful completion of the qualification process is a precursor to a design receiving approval to be released for sale or for a manufacturing or assembly process to be approved.
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The MIDAS range of automated test systems perform fully automated DUT (Device Under Test) Burn-In and Test During Burn-In (TDBI)
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Our Independent Test Laboratory (ITL) provides a complete and confidential test service
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The range of test hardware we provide not only for our own systems but also for almost any other test system is comprehensive and covers such items as Burn-In Boards, HAST Boards and all of the associated control boards such as Driver Boards
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Our systems are designed to test Logic, Memory, Microprocessor, VLSI, Analogue, Mixed Signal, S.O.C. (System-on-Chip) and Optical semiconductor devices.
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Our standard test FlexitrayT and MIDAST systems provide options for up to 6 independent temperature zones
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Our systems provide a wide range of capacities from 3-trays to 48-trays per temperature zone. The number of devices depends on package style & configuration
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We provide a complete range of test boards to suit all leading HAST Chamber types using proven concepts sustaining this hostile environment
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The modular nature and range of our test systems offers total flexibility for these applications
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We are able to offer our experience in developing the most suitable method and configuration for activating your devices.
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We provide Burn-In hardware for all manufactures, including: AEHR, Wakefield, Micro Control, Criteria, Rel Inc, ELES, Sharetree and many others.
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The MIDAST system (See product pages) provides full programming options including Text File Generation, ATE Program Conversion and unique Graphical Waveform Editor (EDDY).
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INDEPENDENT TEST LABORATORY FAQ'S
We provide a complete service on custom designs for application specific devices.
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We offer a range of test options, including Thermal Shock, Temperature Cycling, & Temperature Humidity.
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All our test systems are configured to provide where required, monitoring of volts, amps and dynamic output signals, etc.
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Our standard C.of.C. offers you a qualified test record with complete test results.
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